Nanometer-thick copper films grown by thermal atomic layer deposition was written by Zhong, Zhenyu;Wang, Xiuqin;Ding, Jianning;Yuan, Ningyi. And the article was included in Thin Solid Films in 2015.Related Products of 14781-45-4 This article mentions the following:
Because of the superior properties of copper, it has been of great interest as a conducting material to replace aluminum in device manufacturing In this study, we investigated the influence of substrate temperature, film thickness, and rapid thermal annealing (RTA) on the deposition of Cu films of thickness less than 10 nm. Compared to thicker films, the elec. properties of nanometer-thick films were found to be very sensitive to the deposition temperature Further, we determined the optimal deposition temperature to obtain low-resistivity nanometer-thick Cu films. The Cu films were deposited with island-type growth, and the interconnection between grains plays a major role in the resistivity of the films. We also determined the critical thickness at which Cu films exhibit continuous growth as 8 nm. After RTA, the film color darkened, electron scattering became weak, and the resistivity reduced more than 20% with annealing at 300-350 °C, because of the growth of Cu grains. The results of this study indicate that thermal ALD can be used in conjunction with RTA to produce low-resistivity Cu thin films, the thickness, uniformity, and conformality of which can be easily controlled. In the experiment, the researchers used many compounds, for example, copper(ii)hexafluor-2,4-pentanedionate (cas: 14781-45-4Related Products of 14781-45-4).
copper(ii)hexafluor-2,4-pentanedionate (cas: 14781-45-4) belongs to copper catalysts. Copper catalyst has received great attention owing to the low toxicity and low cost. Copper nanoparticles can also catalyze the coupling reaction of phenols, thiols, xanthogenates, nitrogen-containing nucleophiles, selenium ruthenium nucleophiles and the like.Related Products of 14781-45-4
Referemce:
Copper catalysis in organic synthesis – NCBI,
Special Issue “Fundamentals and Applications of Copper-Based Catalysts”